Interposer and method for manufacturing interposer

Details Interposer and method for manufacturing interposer Interposer and method for manufacturing interposer

2008-12-29

2011-11-15

Nguyen, Hoa C (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C174S255000, C361S760000, C361S767000

Reexamination Certificate

active

08058563

ABSTRACT:
An interposer includes an inorganic insulating layer, a first wiring formed in or on a surface of the inorganic insulating layer, an organic insulating layer formed over the inorganic insulating layer and on the first wiring, a second wiring formed on the organic insulating layer, and a conductor portion connecting the first wiring and the second wiring.

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patent: 6737741 (2004-05-01), Imasu et al.
patent: 2007/0128465 (2007-06-01), Liu et al.
patent: 2005-317705 (2005-11-01), None
patent: 2006-019368 (2006-01-01), None
patent: 2006-294692 (2006-10-01), None

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