Interposer and electronic device fabrication method

Details Interposer and electronic device fabrication method Interposer and electronic device fabrication method

2008-07-29

2008-07-29

Patel, Ishwar (I. B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C361S760000

Reexamination Certificate

active

11339661

ABSTRACT:
An interposer2including a base10formed of a plurality of resin layers26, 34, 42, 52, 56; a thin-film capacitor12buried in the base10, including a lower electrode20, a capacitor dielectric film22and an upper electrode24; a first through-electrode 14bformed through the base10and electrically connected to the upper electrode24of the thin-film capacitor12; and a second through-electrode14aformed through the base10and electrically connected to the lower electrode20of the thin-film capacitor12, further including: an interconnection48buried in the base10and electrically connected to the respective upper electrodes24of a plurality of the thin-film capacitors12, a plurality of the first through-electrodes14bbeing electrically connected to the upper electrodes24of said plurality of the thin-film capacitors12via the interconnection48, and said plurality of the first through-electrodes14bbeing electrically interconnected by the interconnections48.

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