Interposer and electronic device fabrication method

Details Interposer and electronic device fabrication method Interposer and electronic device fabrication method

2011-05-10

2011-05-10

Banks, Derris H (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S845000, C029S846000, C029S852000, C156S249000

Reexamination Certificate

active

07937830

ABSTRACT:
An interposer2comprising a base10formed of a plurality of resin layers26, 34, 42, 52, 56; a thin-film capacitor12buried in the base10, including a lower electrode20, a capacitor dielectric film22and an upper electrode24; a first through-electrode14bformed through the base10and electrically connected to the upper electrode24of the thin-film capacitor12; and a second through-electrode14aformed through the base10and electrically connected to the lower electrode20of the thin-film capacitor12, further comprising: an interconnection48buried in the base10and electrically connected to the respective upper electrodes24of a plurality of the thin-film capacitors12, a plurality of the first through-electrodes14bbeing electrically connected to the upper electrodes24of said plurality of the thin-film capacitors12via the interconnection48, and said plurality of the first through-electrodes14bbeing electrically interconnected by the interconnections48.

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Japanese Office Action mailed Nov. 2, 2010, w/ English Translation.

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