Interposer, a method for manufacturing the same and an...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S766000, C361S793000, C361S795000, C361S301100, C361S303000, C174S262000

Reexamination Certificate

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07911802

ABSTRACT:
An interposer including: a substrate including a first layer and second layer, wherein the first layer and second layer are positioned parallel to each other; electrodes each having a concave-convex structure formed on each facing surface of the first layer and second layer of the substrate; a dielectric layer sandwiched between the electrodes which are formed on each facing surface of the first layer and second layer of the substrate; a first conductive part which vertically passes through the first layer of the substrate from a first outer surface of the substrate and is electrically connected to an electrode formed on a surface of the second layer of the substrate that faces the first layer of the substrate; and a second conductive part which vertically passes through the second layer of the substrate from a second outer surface of the substrate and is electrically connected to an electrode formed on a surface of the first layer of the substrate that faces the second layer of the substrate.

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patent: 6970362 (2005-11-01), Chakravorty
patent: 7233480 (2007-06-01), Hayashi et al.
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patent: 2008/0285244 (2008-11-01), Knickerbocker
patent: 2001-177004 (2001-06-01), None
patent: 2001-508948 (2001-07-01), None
patent: 2003-78061 (2003-03-01), None
patent: WO 98/32166 (1998-07-01), None

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