Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-03-22
2011-03-22
Levi, Dameon E (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S766000, C361S793000, C361S795000, C361S301100, C361S303000, C174S262000
Reexamination Certificate
active
07911802
ABSTRACT:
An interposer including: a substrate including a first layer and second layer, wherein the first layer and second layer are positioned parallel to each other; electrodes each having a concave-convex structure formed on each facing surface of the first layer and second layer of the substrate; a dielectric layer sandwiched between the electrodes which are formed on each facing surface of the first layer and second layer of the substrate; a first conductive part which vertically passes through the first layer of the substrate from a first outer surface of the substrate and is electrically connected to an electrode formed on a surface of the second layer of the substrate that faces the first layer of the substrate; and a second conductive part which vertically passes through the second layer of the substrate from a second outer surface of the substrate and is electrically connected to an electrode formed on a surface of the first layer of the substrate that faces the second layer of the substrate.
REFERENCES:
patent: 5574630 (1996-11-01), Kresge et al.
patent: 6970362 (2005-11-01), Chakravorty
patent: 7233480 (2007-06-01), Hayashi et al.
patent: 2003/0201476 (2003-10-01), Cheng et al.
patent: 2003/0215619 (2003-11-01), Ooi et al.
patent: 2005/0000729 (2005-01-01), Iljima et al.
patent: 2005/0012566 (2005-01-01), Kushitani et al.
patent: 2006/0076600 (2006-04-01), Nakabayashi et al.
patent: 2008/0285244 (2008-11-01), Knickerbocker
patent: 2001-177004 (2001-06-01), None
patent: 2001-508948 (2001-07-01), None
patent: 2003-78061 (2003-03-01), None
patent: WO 98/32166 (1998-07-01), None
Chen Liyi
Kawano Shuichi
Ibiden Co. Ltd.
Levi Dameon E
Nguyen Hoa C
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
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