Interposable heat sink for adjacent memory modules

Details Interposable heat sink for adjacent memory modules Interposable heat sink for adjacent memory modules

2007-05-09

2008-03-11

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S715000, C361S719000

Reexamination Certificate

active

07342797

ABSTRACT:
A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

REFERENCES:
patent: 6088228 (2000-07-01), Petersen et al.
patent: 6349035 (2002-02-01), Koenen
patent: 6762942 (2004-07-01), Smith
patent: 7023701 (2006-04-01), Stocken et al.
patent: 2006/0203454 (2006-09-01), Chang

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