Interposable heat sink for adjacent memory modules

Details Interposable heat sink for adjacent memory modules Interposable heat sink for adjacent memory modules

2007-10-30

2007-10-30

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S715000, C361S721000, C174S016100, C165S080300, C257S712000

Reexamination Certificate

active

11093445

ABSTRACT:
A h9eat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

REFERENCES:
patent: 4190098 (1980-02-01), Hanlon
patent: 4899255 (1990-02-01), Case et al.
patent: 5225965 (1993-07-01), Bailey et al.
patent: 5309979 (1994-05-01), Brauer
patent: 5959839 (1999-09-01), Gates
patent: 5966287 (1999-10-01), Lofland et al.
patent: 6021048 (2000-02-01), Smith
patent: 6219240 (2001-04-01), Sasov
patent: 6233150 (2001-05-01), Lin et al.
patent: 6362966 (2002-03-01), Ali et al.
patent: 6424532 (2002-07-01), Kawamura
patent: 6465728 (2002-10-01), McLaughlin et al.
patent: 6496375 (2002-12-01), Patel et al.
patent: 6535387 (2003-03-01), Summers et al.
patent: 6542365 (2003-04-01), Inoue
patent: 6853554 (2005-02-01), Bash et al.
patent: 6882533 (2005-04-01), Bash et al.
patent: 7023701 (2006-04-01), Stocken et al.
patent: 7187552 (2007-03-01), Stewart et al.
patent: 2003/0076657 (2003-04-01), Summers et al.
patent: 2005/0117303 (2005-06-01), Nagahashi

Affiliated with

Also associated with

Rating

Interposable heat sink for adjacent memory modules does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interposable heat sink for adjacent memory modules, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interposable heat sink for adjacent memory modules will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3853292