Abrading – Precision device or process - or with condition responsive... – Controlling temperature
Reexamination Certificate
2007-08-15
2009-12-22
Rachuba, Maurina (Department: 3727)
Abrading
Precision device or process - or with condition responsive...
Controlling temperature
C451S041000, C451S056000, C451S527000
Reexamination Certificate
active
07635290
ABSTRACT:
Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continuous non-fugitive phase and a substantially co-continuous fugitive phase. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.
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Deibert Thoams S.
Rachuba Maurina
Rohm and Haas Electronic Materials CMP Holdings Inc.
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