Interpenetrating network for chemical mechanical polishing

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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C451S527000, C451S536000

Reexamination Certificate

active

07635291

ABSTRACT:
Chemical mechanical polishing pads are provided, wherein the chemical mechanical polishing pads have a polishing layer comprising an interpenetrating network including a continuous non-fugitive phase and a substantially co-continuous fugitive phase. Also provided are methods of making the chemical mechanical polishing pads and for using them to polish substrates.

REFERENCES:
patent: 4931287 (1990-06-01), Bae et al.
patent: 5976000 (1999-11-01), Hudson
patent: 6069080 (2000-05-01), James et al.
patent: 6099394 (2000-08-01), James et al.
patent: 6296717 (2001-10-01), Ticknor et al.
patent: 6533645 (2003-03-01), Tolles
patent: 6857941 (2005-02-01), Emami et al.
patent: 6899611 (2005-05-01), Reinhardt et al.
patent: 6992123 (2006-01-01), Shiho et al.
patent: 7037184 (2006-05-01), Petroski et al.
patent: 7112125 (2006-09-01), Hirabayashi et al.
patent: 7160178 (2007-01-01), Gagliardi et al.
patent: 7374474 (2008-05-01), Nishiyama et al.
patent: 2004/0226620 (2004-11-01), Therriault et al.
patent: 2004/0259479 (2004-12-01), Sevilla
patent: 2004/0266326 (2004-12-01), Shiho et al.
patent: 2006/0052040 (2006-03-01), Prasad
patent: 2007/0190909 (2007-08-01), Muldowney
patent: 2007/0190916 (2007-08-01), Muldowney
patent: 2007/0238297 (2007-10-01), Chandrasekaran et al.
patent: 2009/0047876 (2009-02-01), Muldowney
patent: 2009/0047877 (2009-02-01), Muldowney
patent: 2009/0047883 (2009-02-01), Muldowney
patent: 2007011158 (2007-01-01), None
Tan, et al., Layer-by-layer microfluidics for biomimetic three-dimensional structures, Biomaterials 25 (2004) 1355-1364.
Tol, et al., Phase morphology and stability of co-continuous (PPE/PS)/PA6 and PS/PA6 blends: effect of rheology and reactive compatibilization, Polymer 45 (2004) 2587-2601.
Galloway, et al., Effect of sample size on solvent extraction for detecting cocontinuity in polymer blends, Polymer 45 (2004) 423-428.
Steigarwald, et al., Chemical mechanical planarization of microelectronic materials, John Wiley & Sons, Inc., New York, NY, pp. 66-83 (1997).

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