Interpenetrating dual cure resin compositions

Details Interpenetrating dual cure resin compositions Interpenetrating dual cure resin compositions

1980-09-29

1982-08-03

Michl, Paul R.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

B05D 306

Patent

active

043427936

ABSTRACT:
Curable resin compositions are prepared containing a radiation-sensitive reactive diluent and a saturated polyol. Curing is accomplished by mixing the reactive diluent and the polyol with a polyisocyanate, followed by exposure of the resultant composition to radiation to polymerize the reactive diluent and then, by thermal curing, to form the hydroxyisocyanate (urethane) linkage. The fully cured resin composition is described as interpenetrated or one in which there is no cross-linking between the reactive diluent and urethane linked co-polymer. The interpenetrated resin compositions form tough and hard coatings on various substrates.

REFERENCES:
patent: 3509234 (1970-04-01), Burlant
patent: 3719638 (1973-03-01), Huemmer
patent: 3776729 (1973-12-01), Levy
patent: 3929929 (1975-12-01), Kuehn
patent: 4025346 (1977-05-01), Petke
patent: 4034017 (1977-07-01), Chang

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