Internal wiring structure of a semiconductor device

Details Internal wiring structure of a semiconductor device Internal wiring structure of a semiconductor device

1992-12-03

1995-04-25

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 524, 257678, 257668, 257723, 361728, 361752, 361813, H05K 114, H01L 23053

Patent

active

054104505

ABSTRACT:
External lead-through terminals of a semiconductor device, such as a power transistor module, are internally wired to a circuit assembly by a wiring block consisting of one or more conductive lead frames interposed between the lead-through terminals and the circuit assembly.

REFERENCES:
patent: 4819042 (1989-04-01), Kaufman

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