Electric lamp or space discharge component or device manufacturi – Process – With assembly or disassembly
Patent
1996-07-31
1998-06-16
Ramsey, Kenneth J.
Electric lamp or space discharge component or device manufacturi
Process
With assembly or disassembly
313497, H01J 939
Patent
active
057660530
ABSTRACT:
A flat-panel field emission display comprises a luminescent faceplate, a rigid backplate, and an interposed or sandwiched emitter or cathode plate. A positioning spacer or connector ridge is formed on the rear surface of the faceplate to space the cathode plate a fixed distance behind the faceplate. A peripheral seal is formed between the faceplate and the backplate. The faceplate, backplate, and peripheral seal define an evacuated internal space which contains the cathode plate. The backplate is spaced behind the cathode plate to create a rearward vacuum space in which a getter is located.
REFERENCES:
patent: 3665238 (1972-05-01), Van Esdonk et al.
patent: 4387283 (1983-06-01), Peterson et al.
patent: 4857161 (1989-08-01), Borel et al.
patent: 4857799 (1989-08-01), Spindt et al.
patent: 4923421 (1990-05-01), Brodie et al.
patent: 5015912 (1991-05-01), Spindt et al.
patent: 5063327 (1991-11-01), Brodie et al.
patent: 5075591 (1991-12-01), Holmberg
patent: 5140219 (1992-08-01), Kane
patent: 5151106 (1992-09-01), Sandhu
patent: 5157304 (1992-10-01), Kane et al.
patent: 5249732 (1993-10-01), Thomas
patent: 5361079 (1994-11-01), Yamamoto
patent: 5381039 (1995-01-01), Morrison
patent: 5424605 (1995-06-01), Lovoi
patent: 5525861 (1996-06-01), Banno et al.
patent: 5577944 (1996-11-01), Taylor
Montgomery, Clive Richard, "Flip Chip Assemblies Using Conventional Wire Bonding Apparatus and Commercially available Dies," ISHM '93 Proceedings, pp. 451-456.
IBM Technical Disclosure, "Direct Chip Bonding For Liquid Crystal Display", vol. 34, No. 5, Oct. 1991, pp. 183-184.
"Liquid Crystal Display Products", Product Brochure, Standish LCD, Division of Standish Industries, Inc., pp. 5-6.
"Process-Stablized Extrude Bonding Wire and Ribbon", Product Brochure, Hydrostatics Inc., Bethlehem, PA, (Jun. 1991).
Kondoh, You et al. "A Subminiature CCD Module Using a New Assembly Technique", IEICE Transactions, vol. E 74, No. 8 Aug. 1991.
Cohen, I.M. et al. "Ball Formation Processes in Aluminum Bonding Wire", Solid State Technology, pp. 89-92, Dec. 1985.
Levy, F. et al. "Phosphors for Full Color Microtips Fluorescent Displays", pp.20-23, IEEE, 1991.
Kang, Sa-Yoon et al. Physical and Fuzzy Logic Modeling of a Flip-Chip Thermocompression Bonding Process, Journal of Electronic Packaging, pp. 63-70, Mar. 1993.
Charles, Jr., H.K. "Electronic Materials Handbook--vol. 1 Packaging", Product Brochure, ASM International.
Cathey David A.
Watkins Charles
Micro)n Technology, Inc.
Ramsey Kenneth J.
LandOfFree
Internal plate flat-panel field emission display does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Internal plate flat-panel field emission display, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Internal plate flat-panel field emission display will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1718409