Internal package heat dissipator

Details Internal package heat dissipator Internal package heat dissipator

2007-01-16

2007-01-16

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE23101

Reexamination Certificate

active

11198580

ABSTRACT:
A technique is provided for dissipating heat from an integrated circuit within a package. A thermally conductive strip may be disposed adjacent to an integrated circuit die before packaging. The package is formed around the integrated circuit and the thermally conductive strip such that a portion of the thermally conductive strip extends through the package. Heat is conducted from the integrated circuit through the thermally conductive strip to the environment surrounding the package. A thermally conductive strip may be installed within a package by an adhesive or other mechanical means. A thermally conductive strip may be comprised of a metallic foil or other thermally conductive material.

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