Internal bridging contact

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration

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Details

257758, 257774, H01L 2348

Patent

active

054101859

ABSTRACT:
A bridging contact between internal contacts in a semiconductor integrated circuit is formed which is insulated from any connection to an intervening feature. A first dielectric layer is deposited over the contacts and the intervening feature, followed by an etch stop layer. The etch stop layer is patterned to form an etch stop mask and a second dielectric layer is deposited over the first dielectric layer and the patterned etch stop. The first and second dielectric layers are etched to form a trench opening and a pair of communicating passageways in the dielectric layers which expose the internal contacts. The etch stop mask protects and controls the vertical and horizontal dimensions of the resultant dielectric insulator that protects the intervening feature. Metal is deposited in the opening and passageways to form a bridging contact between the contacts. The bridging contact is electrically isolated from the intervening feature by the dielectric insulator remaining over and around the intervening feature.

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Yeh et al., "Reverse Pillar and Maskless Contact-Two Novel Recessed Metal Schemes and Their Comparisons to Conventional VLSI Metallization Schemes," IEEE, Jun. 1988, pp. 95-100.

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