Intermetallic nickel-aluminum base alloy and material formed of

Details Intermetallic nickel-aluminum base alloy and material formed of Intermetallic nickel-aluminum base alloy and material formed of

1996-11-21

1999-08-10

Sheehan, John

Metal treatment

Stock

Age or precipitation hardened or strengthened

148428, 420445, 420450, C22C 1905

Patent

active

059353490

ABSTRACT:
An intermetallic nickel-aluminum base alloy has a microstructure which predominantly includes the binary phase NiAl and further contains the elements chromium and tantalum. The content of the elements chromium and tantalum is in total at most 12 atom %. Preferred contents ranges are 0.3 to 3.8 atom % tantalum and 1.0 to 9.0 atom % chromium. The intermetallic nickel-aluminum base alloy is distinguished in particular by high oxidation resistance at high temperatures, such as for example 1350.degree. C. It is therefore suitable for producing components which are exposed to a high long term temperature stress such as, for example, gas turbine blades. Depending on requirements, additional layers protecting against oxidation can be dispensed with due to the high oxidation resistance.

REFERENCES:
patent: 5116691 (1992-05-01), Darolia et al.
patent: 5516380 (1996-05-01), Darolia et al.
"Single-Cristalline-Dentritic Solidification of Geometries similar to Turbine Blades by means of Seed Techniques" (Paul), Series 5, No. 264, VDI Edition, pp. I-XXI and 1-138; 27/92.
"Fractional Viscosity of Intermettalic Alloys" (Reuss), pp. 1-100. May 1991.
"NiA1 Alloys for High-Temperature Structural Applications", The Journal of Metals, Mar. 1991, pp. 44 et seq.
"Lifetime and Fracture of Directionally Crystallized Eutectic Composites", Phys. Met. Metall, vol. 70, No. 2, pp. 194-196, 1990.
CA 113:126250. 1990.
"Phase Composition and Structure of NiAl-based alloys of Ni-Al-Co-M Systems, where M is Ti, Zr, Hf, V, Nb, Ta, Cr, Mo" in Mettaly (3), pp. 85-94 by Povarova, K.B. et al., Mar. 1996.
ASM Handbook, vol. 2, p. 1096, 1990.
D.R. Johnson et al Intermetallics pp. 493-503, 1995.

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