Intermediate material for manufacturing circuit board and...

Details Intermediate material for manufacturing circuit board and... Intermediate material for manufacturing circuit board and...

2006-12-06

2010-11-09

Nguyen, Khanh (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S060000, C156S254000, C156S345420, C156S583200, C428S416000, C428S901000, C428S040100, C427S154000

Reexamination Certificate

active

07828924

ABSTRACT:
An intermediate material which is adapted to manufacture a circuit board includes a prepreg sheet having a through-hole provided therein, a first film provided on a surface of the prepreg sheet and having a first hole communicating with the through-hole, a second film provided on another surface of the prepreg sheet and having a second hole communicating with the through-hole, and a conductive paste filling the though-hole, the first hole, and the second hole. The thickness t1of the prepreg sheet, the minimum diameter rminof the through-hole, the thickness tf1of the first film, the diameter rf1of the first hole, the thickness tf2of the second film, the diameter rf2of the second hole satisfy a relation: rf1/tf1≧3, rf2/tf2≧3, and rmin/(t1+tf1+tf2)≦1.5. This intermediate material provides a circuit board having a fine via-conductor connected to a metal foil securely and stably.

REFERENCES:
patent: 5481795 (1996-01-01), Hatakeyama et al.
patent: 5686172 (1997-11-01), Ohya et al.
patent: 2004/0214006 (2004-10-01), Hirayama et al.
patent: 2005/0006139 (2005-01-01), Takenaka et al.
patent: 6-268345 (1994-09-01), None
patent: 2004-221236 (2004-08-01), None
patent: 2004-343086 (2004-12-01), None
International Search Report issued Jan. 9, 2007 in the International (PCT) Application of which the present application is the U.S. National Stage.

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