Intermediate load mechanism for a semiconductor package

Details Intermediate load mechanism for a semiconductor package Intermediate load mechanism for a semiconductor package

2007-09-20

2008-10-21

Gushi, Ross N (Department: 2833)

Electrical connectors

With coupling movement-actuating means or retaining means in...

For dual inline package

C439S342000

Reexamination Certificate

active

07438580

ABSTRACT:
In one embodiment, the present invention includes a load frame to be affixed to a primary surface of a circuit board adjacent to a socket, a load plate having a proximal portion rotatably adapted to the load frame and a distal portion having a tongue member to be locked by a shoulder member adapted to the circuit board on a side of the socket opposite to the frame, and a load lever to mate the load plate to the load frame, where the load lever is rotatable from an open position to an engaged position to lock the tongue member of the load plate under a head of the shoulder member. Other embodiments are described and claimed.

REFERENCES:
patent: 6969267 (2005-11-01), Byquist
patent: 7033198 (2006-04-01), Chiang
patent: 7247043 (2007-07-01), Lai
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patent: 2006/0141840 (2006-06-01), Ma
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patent: 2008/0081489 (2008-04-01), MacGregor et al.
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U.S. Appl. No. 11/541,714, filed Sep. 29, 2006, entitled “Reliable Land Grid Array Socket Loading Device,” by Mike G. MacGregor, et al.

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