Intermediate anneal for metal deposition

Details Intermediate anneal for metal deposition Intermediate anneal for metal deposition

2007-03-20

2007-03-20

Wyszomierski, George (Department: 1742)

Metal treatment

Process of modifying or maintaining internal physical...

Producing or treating layered, bonded, welded, or...

C148S536000, C438S660000, C438S687000

Reexamination Certificate

active

10651765

ABSTRACT:
The present teachings and illustrations describe a process for forming a plurality of conductive structures in or on a substrate. In one embodiment, the process comprises forming a plurality of recesses in or on the substrate, wherein the plurality of recesses include recesses having different dimensions. In addition, the process further comprises (i) forming a conductive layer which at least partially fills the plurality of recesses and (ii) treating the conductive layer to improve the conductive properties of the conductive layer. Moreover, the process still further comprises (iii) sequentially repeating acts (i) and (ii) until each of the recesses of the plurality of recesses are filled to a desired dimension and such that the conductive material in the recesses of smaller dimension are more uniformly adhered to the bottom surfaces of the recesses.

REFERENCES:
patent: 6433402 (2002-08-01), Woo et al.
patent: 6958247 (2005-10-01), Marxsen et al.
patent: 2004/0014312 (2004-01-01), Kunishima et al.
patent: 2004/0198055 (2004-10-01), Wang

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