Interlevel dielectric with multiple air gaps between conductive

Details Interlevel dielectric with multiple air gaps between conductive Interlevel dielectric with multiple air gaps between conductive

1998-04-20

1999-11-30

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257760, 438622, 438624, H01L 2348, H01L 2352, H01L 2940

Patent

active

059947764

ABSTRACT:
A method of forming low dielectric insulation between pairs of conductive lines separated by insulating material of a level of interconnection for integrated circuits by selectively removing portions of the insulating material to create spaces for containing a gas with a dielectric constant of slightly above 1. Preferably, the insulating material is a conformal source of silicon oxide, such as tetraethylorthosilicate. The resultant method forms an insulation separating the conductive lines whose composite dielectric constant with the gas in the spaces between the insulating material is not greater than about 3 over a predetermined distance. An integrated circuit having a plurality of semiconductor devices being interconnected by conductive lines separated by insulating material and spaces containing a gas, composite dielectric constant of which is not greater than about 3 over a predetermined distance.

REFERENCES:
patent: 5124014 (1992-06-01), Foo et al.
patent: 5275977 (1994-01-01), Otaubo et al.
patent: 5407860 (1995-04-01), Stoltz et al.
patent: 5461003 (1995-10-01), Havemann et al.
patent: 5468685 (1995-11-01), Orisaka et al.
patent: 5470801 (1995-11-01), Kapoor et al.
patent: 5471093 (1995-11-01), Cheung
patent: 5476817 (1995-12-01), Numata
patent: 5519250 (1996-05-01), Numata
patent: 5548159 (1996-08-01), Jeng

Affiliated with

Also associated with

Rating

Interlevel dielectric with multiple air gaps between conductive does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interlevel dielectric with multiple air gaps between conductive , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interlevel dielectric with multiple air gaps between conductive will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1676267