Electric power conversion systems – Current conversion – Including d.c.-a.c.-d.c. converter
Reexamination Certificate
2007-11-13
2007-11-13
Han, Jessica (Department: 2838)
Electric power conversion systems
Current conversion
Including d.c.-a.c.-d.c. converter
C363S065000, C363S132000
Reexamination Certificate
active
10861319
ABSTRACT:
A power converter architecture interleaves full bridge converters to alleviate thermal management problems in high current applications, and may, for example, double the output power capability while reducing parts count and costs. For example, one phase of a three phase inverter is shared between two transformers, which provide power to a rectifier such as a current doubler rectifier to provide two full bridge DC/DC converters with three rather than four high voltage inverter legs.
REFERENCES:
patent: 4142231 (1979-02-01), Wilson et al.
patent: 4224663 (1980-09-01), Maiese et al.
patent: 4458305 (1984-07-01), Buckle et al.
patent: 4661897 (1987-04-01), Pitel
patent: 4674024 (1987-06-01), Paice et al.
patent: 5172310 (1992-12-01), Deam et al.
patent: 5184291 (1993-02-01), Crowe et al.
patent: 5230632 (1993-07-01), Baumberger et al.
patent: 5243757 (1993-09-01), Grabbe et al.
patent: 5264761 (1993-11-01), Johnson
patent: 5395252 (1995-03-01), White
patent: 5422440 (1995-06-01), Palma
patent: 5439398 (1995-08-01), Testa et al.
patent: 5445526 (1995-08-01), Hoshino et al.
patent: 5459356 (1995-10-01), Schulze et al.
patent: 5508560 (1996-04-01), Koehler et al.
patent: 5537074 (1996-07-01), Iversen et al.
patent: 5559374 (1996-09-01), Ohta et al.
patent: 5635751 (1997-06-01), Ikeda et al.
patent: 5653598 (1997-08-01), Grabbe
patent: 5756935 (1998-05-01), Balanovsky et al.
patent: 5847951 (1998-12-01), Brown et al.
patent: 5938451 (1999-08-01), Rathburn
patent: 5973923 (1999-10-01), Jitaru
patent: 5975914 (1999-11-01), Uchida
patent: 6038156 (2000-03-01), Inam et al.
patent: 6054765 (2000-04-01), Eytcheson et al.
patent: 6072707 (2000-06-01), Hochgraf
patent: 6078173 (2000-06-01), Kumar et al.
patent: 6078501 (2000-06-01), Catrambone et al.
patent: 6144276 (2000-11-01), Booth
patent: 6166937 (2000-12-01), Yamamura et al.
patent: 6176707 (2001-01-01), Neidich et al.
patent: 6211767 (2001-04-01), Jitaru
patent: 6212087 (2001-04-01), Grant et al.
patent: 6222437 (2001-04-01), Soto et al.
patent: 6233149 (2001-05-01), Bailey et al.
patent: 6278354 (2001-08-01), Booth
patent: 6292371 (2001-09-01), Toner, Jr.
patent: 6388898 (2002-05-01), Fan et al.
patent: 6434008 (2002-08-01), Yamada et al.
patent: 6498320 (2002-12-01), Moriguchi et al.
patent: 6603672 (2003-08-01), Deng et al.
patent: 7015658 (2006-03-01), Tsay et al.
patent: 2002/0034088 (2002-03-01), Parkhill et al.
patent: 2002/0109152 (2002-08-01), Kobayashi et al.
patent: 2002/0111050 (2002-08-01), Parkhill et al.
patent: 2002/0118560 (2002-08-01), Ahmed et al.
patent: 2002/0126465 (2002-09-01), Maly et al.
patent: 2002/0167828 (2002-11-01), Parkhill et al.
patent: 2003/0007366 (2003-01-01), Drummond et al.
patent: 2004/0228094 (2004-11-01), Ahmed et al.
patent: 195 19 538 (1996-11-01), None
patent: 0 427 143 (1991-05-01), None
patent: 0 578 108 (1994-01-01), None
patent: 9-117126 (1997-05-01), None
Mohan et al.,Power Electronics: Converters, Applications and Designs, John Wiley & Sons Inc., USA, 1989, Chapter 26-8, “Circuit Layout,” p. 654, no month.
Persson, E., “Power Electronic Design and Layout Techniques for Improved Performance and Reduced EMI,” in Proceedings of Power Electronics in Transportation,IEEE, Dearborn, Michigan, Oct. 20-21, 1994, pp. 79-82.
U.S. Appl. No. 60/233,992, filed Sep. 20, 2000, Parkhill et al.
U.S. Appl. No. 60/233,993, filed Sep. 20, 2000, Parkhill et al.
U.S. Appl. No. 60/233,994, filed Sep. 20, 2000, Parkhill et al.
U.S. Appl. No. 60/233,995, filed Sep. 20, 2000, Parkhill et al.
U.S. Appl. No. 60/233,996, filed Sep. 20, 2000, Parkhill et al.
U.S. Appl. No. 60/471,387, filed May 16, 2003, Flett et al.
Easler, K., “Continued Study in Power Module Substrates for Automotive Harsh Environments,” Kyocera America, Inc., 4 pages, dated no earlier than Nov. 2002.
de Sorgo, M., “A Thermal Comparison of Power Device Mounting Technologies,” Chomerics, 7 pages, Dec. 1, 2000.
Sugai, K., et al., “A New Structure of Low Inductance Ceramic Substrate for Power Module,” inProceedings of the 3rdIntl. Congress for 42V PowerNet, Munich, Germany, Nov. 12-14, 2002, 13 pages.
Boroyevich, D., et al., “A View at the Future of Integration in Power Electronics Systems,” inProceedings of the PCIM Europe 2005, Nuremberg, Germany, Jun. 7, 2005, pp. 11-20.
Lee, F., et al., “Technology Trends Toward a System-in-a-Module in Power Electronics,”IEEE Circuits and Systems Magazine,, 2(4):4-23, Fourth Quarter 2002.
Hirokawa, M., et al., “Improvement of Transient Response in High-Current Output DC—DC Converters,” inProceedings of the 18thAnnual IEEE Applied Power Electronics Conference and Exposition, Miami Beach, FL, Feb. 9-13, 2003, pp. 705-710.
Panov, Y., et al., “Design and Performance Evaluation of Low-Voltage/High-Current DC/DC On-Board Modules,” inProceedings of the 14thAnnual IEEE Applied Power Electronics Conference and Exposition, Dallas, TX, Mar. 14-18, 1999, pp. 545-552.
Xu, P., et al., “A Family of Novel Interleaved DC/DC Converters for Low-Voltage High-Current Voltage Regulator Module Applications,” inProceedings of the 32ndAnnual IEEE Power Electronics Specialists Conference, Vancouver, Canada, Jun. 17-21, 2001, pp. 1507-1511.
Han Jessica
Siemens VDO Automotive Corporation
LandOfFree
Interleaved power converter does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Interleaved power converter, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interleaved power converter will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3874299