Interleaved memory heat sink

Details Interleaved memory heat sink Interleaved memory heat sink

2007-06-19

2007-06-19

Dinh, Tuan (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S702000, C361S697000

Reexamination Certificate

active

10939198

ABSTRACT:
A heat sink comprises a heat sink base and a row of heat sink extensions that are attached to one side of the heat sink base. An interleaved heat sink structure includes a first row and a second row of heat sink extensions. The first row and the second row of heat sink extensions are coupled respectively to a first and a second heat sink bases. The first and the second heat sink bases are thermally coupled to a first plurality of memory packages and a second plurality of memory packages, respectively. The first row of heat sink extensions is parallel to and at least partially interleaved with the second row of heat sink extensions. A memory heat dissipation control system and a method for assembly a memory part that includes a DIME and two heat sinks are also described.

REFERENCES:
patent: 5444304 (1995-08-01), Hara et al.
patent: 5535816 (1996-07-01), Ishida
patent: 6165612 (2000-12-01), Misra
patent: 7079396 (2006-07-01), Gates et al.
patent: 2006/0060328 (2006-03-01), Ewes et al.
patent: 2003-0078301 (2003-10-01), None

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