Interleaved-fin thermal connector

Details Interleaved-fin thermal connector Interleaved-fin thermal connector

1997-11-14

2000-10-31

Leo, Leonard

Heat exchange

Heat transmitter

174 163, 257722, 361704, 165 803, H05K 720

Patent

active

061387487

ABSTRACT:
In order to provide a thermal coupling between a heat source and a heat sink, an interleaved-fin connector is provided. The connector comprises first and second substrates. The first substrate includes a first surface. A plurality of first channels are etched on the first surface to form a plurality of first fins and a first base. The first base can be thermally engaged with the heat source. The second substrate includes a second surface having a plurality of second channels etched therein. The second channels form a plurality of second fins and a second base. The second base can be thermally engaged with the heat sink. The first and second fins providing a thermally conductive path from the heat source to the heat sink when interleaved with each other.

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IEEE, 1991, 0569-5503/91/0000-0693, "Hardware Technology for HITACHI M-880 Processor Group", F. Kobayashi t al [1991 Proceedings of the 41st Electronic Components & Technology Conference, Atlanta, Georgia], pp. i-13.
"Interleaved Fin Thermal Connectors for Multichip Modules", W. Hamburgen, WRL Research Report 91/9 Aug. 1991, Digital Equipment Corporation, Western Research Lab, 250 University Ave., Palo Alto, California 94301 USA, pp. 1-8.
Chemical Etching and Slice Cleanup, Standard (110) Projection for Silicon (Face-Centered Cubic) Crystal Showing Rhombic Pattern Alignment with the 90 (111) Traces, p. 1.

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