Heat exchange – Heat transmitter
Patent
1996-07-01
1998-08-04
Leo, Leonard R.
Heat exchange
Heat transmitter
174 163, 257722, 361704, F28F 700
Patent
active
057879761
ABSTRACT:
In order to provide a thermal coupling between a heat source and a heat sink, an interleaved-fin connector is provided. The connector comprises first and second substrates. The first substrate includes a first surface. A plurality of first channels are etched on the first surface to form a plurality of first fins and a first base. The first base can be thermally engaged with the heat source. The second substrate includes a second surface having a plurality of second channels etched therein. The second channels form a plurality of second fins and a second base. The second base can be thermally engaged with the heat sink. The first and second fins providing a thermally conductive path from the heat source to the heat sink when interleaved with each other.
REFERENCES:
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patent: 4448240 (1984-05-01), Sharon
patent: 4770242 (1988-09-01), Daikoku et al.
patent: 4800956 (1989-01-01), William
patent: 5083373 (1992-01-01), William
IEEE, 1991.COPYRGT., 0569-5503/91/0000-0693, "Hardware Technology for the 41st Electronic Components & Technology Conference, Atlanta, Georgia!.
"Interleaved Fin Thermal Connectors for Multichip Modules," William R. Hamburgen, WRL Research Report 91/9, Aug. 1991, Digital Equipment corp., Western Research Lab.
Eustace Robert A.
Fitch John S.
Hamburgen William R.
Digital Equipment Corporation
Leo Leonard R.
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