Interleaved connector circuit having increased backplane impedan

Details Interleaved connector circuit having increased backplane impedan Interleaved connector circuit having increased backplane impedan

1994-09-30

1997-10-07

Thomas, Laura

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

For receiving coaxial connector

174250, 439 55, 333 99R, 333 1, H05K 102

Patent

active

056740778

ABSTRACT:
Connectors on a microcomputer printed circuit board backplane receive slotted insertion of a plurality of device cards containing application specific integrated circuits (ASICs). Interconnection of the device card connectors is accomplished on the surface of the circuit board or internally with an electric line which interleaves the device card connectors providing increased conductor length between physically adjacent connectors, establishing an increased impedance level. The increased physical lengths of the intervening electric lines between the connectors provide increased impedance as seen by inserted device cards, which enhances the matching capabilities of the connectors.

REFERENCES:
patent: 4060295 (1977-11-01), Tomkiewicz
patent: 5025211 (1991-06-01), Craft et al.
patent: 5557562 (1996-09-01), Yoshiharu et al.
"The Proposed IEEE 896 Futurebus--A Solution to the Bus Driving Problem", National Semiconductor Corp., Application Note 458, R.V. Balakrishnan, undated, pp. 2-94 to 2-95.

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