Interlayer insulating film, wiring structure and electronic...

Details Interlayer insulating film, wiring structure and electronic... Interlayer insulating film, wiring structure and electronic...

2011-04-12

2011-04-12

Clark, Sheila V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

With means to control surface effects

Insulating coating

C257S750000

Reexamination Certificate

active

07923819

ABSTRACT:
A wiring structure of a semiconductor device or the like includes an interlayer insulating film having a fluorocarbon film formed on an underlayer, and a conductor buried in the interlayer insulating film. The fluorocarbon film contains nitrogen and is low in dielectric constant, excellent in reproducibility and stable.

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patent: 11-330075 (1999-11-01), None
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International Search Report for PCT/JP2007/071734 dated Feb. 12, 2008.

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