Interlayer connection structure of multilayer wiring board,...

Details Interlayer connection structure of multilayer wiring board,... Interlayer connection structure of multilayer wiring board,...

2005-07-26

2005-07-26

Talbolt, David L. (Department: 2827)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C254S255000, C254S262000

Reexamination Certificate

active

06921869

ABSTRACT:
A conductive pattern made of copper foil is formed on a base material in each of a plurality of laminated flexible printed circuit boards, and a land is formed to expose the conductive pattern at a predetermined position in the base material. The plurality of flexible printed circuit boards are laminated to adjust each land, and the conductive pattern of each flexible printed circuit board is connected through the each land.

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Yamamoto, Yukio, “100 F.F.C. (Flexible Flat Circuit) Development of th Flexible Flat Circuit -Application to Door Harness-” Nissan Motor Co., LTD., pp. 65-67
Yamamoto, Yukio et al., “F.F.C. (Flexible Flat Circuit) Development of the Flexible Flat Circuit and Application to Automobiles”, vol. 50, No. 2, 1996, pp. 77-80.
Mottate, A. “Development of Automotive New Wiring Harness “FFC””, pp. 15-20.

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