Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent
1997-02-10
1998-09-15
Chaudhuri, Olik
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
257758, 257760, 257762, 257763, H01L 2348, H01L 2352, H01L 2940
Patent
active
058083618
ABSTRACT:
Interconnect via structures in a semiconductor integrated circuit having low resistance. The interconnect via structures connect metal layer structures in the semiconductor device and extend down at least one side of the metal layer structures. The interconnect via structures can extend down a second side of the metal layer structures and can extend down the end of the metal layer structures. The interconnect via structures extend beyond the sides and the end of the metal layer structures by a distance u where u is 1/4 to 1/2 F, where F is a feature of the design rule being used to manufacture the semiconductor device.
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Advanced Micro Devices , Inc.
Cao Phat X.
Chaudhuri Olik
Nelson H. Donald
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