Interfacing of heat sinks with electrical devices, and the like

Heat exchange – With repair or assembly means – Positioner or retainer for settable material

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

165 803, 165185, H01L 2340, F28F 1300

Patent

active

046026789

ABSTRACT:
A relatively thin broad-area dielectric interfacing composed of dual filled layers of compliant silicone rubber in sandwiching relation to a porous glass-cloth carrier, one of the layers being pre-vulcanized and the other being subsequently cured and bonded in place once the composite interfacing has been applied to heat-sink surfaces adapted for abutment with the device for the intended heat transfer. The soft rubber interfacing offers good dielectric and insulating and voltage-breakdown characteristics even when well loaded with thermally-conductive oxides, and intimate voidless surface contacts and high-quality thermal matching are fostered both along abutting compliant surfaces of the pre-cured portion of the interfacing and along fully bonded surfaces of the portion cured in situ. Processing which makes such interfacing eminently practical and particularly advantageous to the user includes initial application of filled uncured rubber to one side of a sheet of the porous carrier, followed by its vulcanization and then by application of a further uncured amount to the opposite side of the carrier. A protective peel-off plastic covering is used to facilitate handling and release-cutting of desired smaller wafer configurations from the large-area composite. Uncured sides of the smaller peeled wafers are then mated with appropriate parts of heat sinks and cured.

REFERENCES:
patent: 2881364 (1959-04-01), Demer et al.
patent: 2887628 (1959-05-01), Zierdt, Jr.
patent: 3083286 (1963-03-01), Swetlitz
patent: 3301315 (1967-01-01), Webb
patent: 3694182 (1972-09-01), Akfirat et al.
patent: 3972821 (1976-08-01), Weidenbenner et al.
patent: 4384610 (1983-05-01), Cook et al.
patent: 4471837 (1984-09-01), Larson
Dombrowskas et al., Conduction Cooled Chip Module, IBM Tech. Disc. Bulletin, vol. 14, No. 9, Feb. 1972, p. 2689.
Bakos et al., Programmable Heat Sink Device for Thermal Enhancement, IBM Tech. Disc. Bull, vol. 22, No. 3, Aug. 1979, p. 957.
Hassan et al., Chip Cooling Employing a Conformable Alloy, IBM Tech. Disc. Bull., vol. 24, No. 11A, Apr. 1982, pp. 5595-5597.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Interfacing of heat sinks with electrical devices, and the like does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interfacing of heat sinks with electrical devices, and the like, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interfacing of heat sinks with electrical devices, and the like will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-696475

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.