Heat exchange – With repair or assembly means – Positioner or retainer for settable material
Patent
1983-09-02
1986-07-29
Richter, Sheldon J.
Heat exchange
With repair or assembly means
Positioner or retainer for settable material
165 803, 165185, H01L 2340, F28F 1300
Patent
active
046026789
ABSTRACT:
A relatively thin broad-area dielectric interfacing composed of dual filled layers of compliant silicone rubber in sandwiching relation to a porous glass-cloth carrier, one of the layers being pre-vulcanized and the other being subsequently cured and bonded in place once the composite interfacing has been applied to heat-sink surfaces adapted for abutment with the device for the intended heat transfer. The soft rubber interfacing offers good dielectric and insulating and voltage-breakdown characteristics even when well loaded with thermally-conductive oxides, and intimate voidless surface contacts and high-quality thermal matching are fostered both along abutting compliant surfaces of the pre-cured portion of the interfacing and along fully bonded surfaces of the portion cured in situ. Processing which makes such interfacing eminently practical and particularly advantageous to the user includes initial application of filled uncured rubber to one side of a sheet of the porous carrier, followed by its vulcanization and then by application of a further uncured amount to the opposite side of the carrier. A protective peel-off plastic covering is used to facilitate handling and release-cutting of desired smaller wafer configurations from the large-area composite. Uncured sides of the smaller peeled wafers are then mated with appropriate parts of heat sinks and cured.
REFERENCES:
patent: 2881364 (1959-04-01), Demer et al.
patent: 2887628 (1959-05-01), Zierdt, Jr.
patent: 3083286 (1963-03-01), Swetlitz
patent: 3301315 (1967-01-01), Webb
patent: 3694182 (1972-09-01), Akfirat et al.
patent: 3972821 (1976-08-01), Weidenbenner et al.
patent: 4384610 (1983-05-01), Cook et al.
patent: 4471837 (1984-09-01), Larson
Dombrowskas et al., Conduction Cooled Chip Module, IBM Tech. Disc. Bulletin, vol. 14, No. 9, Feb. 1972, p. 2689.
Bakos et al., Programmable Heat Sink Device for Thermal Enhancement, IBM Tech. Disc. Bull, vol. 22, No. 3, Aug. 1979, p. 957.
Hassan et al., Chip Cooling Employing a Conformable Alloy, IBM Tech. Disc. Bull., vol. 24, No. 11A, Apr. 1982, pp. 5595-5597.
Haugen Orrin M.
Nikolai Thomas J.
Richter Sheldon J.
The Bergquist Company
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