Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-07-19
2009-06-30
Chervinsky, Boris L (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S695000, C361S697000, C361S715000, C257S706000, C257S721000, C257S722000, C165S080300
Reexamination Certificate
active
07554806
ABSTRACT:
An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.
REFERENCES:
patent: 5894882 (1999-04-01), Kikuchi et al.
patent: 6172416 (2001-01-01), Miyahara et al.
patent: 6256201 (2001-07-01), Ikeda et al.
patent: 6351382 (2002-02-01), Nakanishi et al.
patent: 6552906 (2003-04-01), Kanada
patent: 6750536 (2004-06-01), Stewart
patent: 6816377 (2004-11-01), Itabashi et al.
patent: 6861750 (2005-03-01), Zhao et al.
patent: 6879488 (2005-04-01), Takeda et al.
patent: 6982877 (2006-01-01), Vinson et al.
patent: 2002/0008963 (2002-01-01), DiBene et al.
patent: 2003/0081389 (2003-05-01), Nair et al.
patent: 2004/0190260 (2004-09-01), Sasaki
patent: 2006/0037741 (2006-02-01), Tokuhira et al.
patent: 2006/0268527 (2006-11-01), Tanaka et al.
patent: 10-173114 (1998-06-01), None
patent: 11-352362 (1999-12-01), None
patent: 2002-289750 (2002-10-01), None
Jerome Eichenberger, et al., “Multi-Channel Optical Interconnection Modules Up to 2.5Gb/s.ch”, IEEE, 2001 Electronic Components and Technology Conference, Proceedings, pp. 880-885.
Takashi Yoshikawa, et al., “Optical-Interconnection as an IP Macro of a CMOS Library”, Hot Interconnects 9, Symposium on High Performance Interconnects, IEEE, 2001, pp. 31-35.
Furuyama Hideto
Hamasaki Hiroshi
Chervinsky Boris L
Kabushiki Kaisha Toshiba
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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