Interface module-mounted LSI package

Details Interface module-mounted LSI package Interface module-mounted LSI package

2006-12-26

2006-12-26

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S715000, C361S719000, C361S695000, C361S697000, C257S706000, C257S721000, C257S722000, C165S080300

Reexamination Certificate

active

07154751

ABSTRACT:
An interface module-mounted LSI package has an interposer equipped with a signal processing LSI, an interface module for signal transmission, mechanically connected to the interposer and electrically connected to the signal processing LSI, and a heat sink which is in contact with both the signal processing LSI and the interface module, and radiates heat of the signal processing LSI and the interface module. The LSI package has a gap, which serves as a heat resistor portion between the heat radiating portion for the signal processing LSI and the heat radiating portion for the interface module.

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Jerome Eichenberger, et al., “Multi-Channel Optical Interconnection Modules up to 2.5Gb/s.ch”, IEEE, 2001 Electronic Components and Technology Conference, Proceedings, pp. 880-885.
Takashi Yoshikawa, et al., “Optical-Interconnection as an IP Macro of a CMOS Library”, Hot Interconnects 9, Symosium on High Performance Interconnects, IEEE, 2001, pp. 31-35.

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