Interface for UV-curable adhesives

Details Interface for UV-curable adhesives Interface for UV-curable adhesives

2008-05-13

2008-05-13

Lewis, Monica (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Organic semiconductor material

C257SE51022

Reexamination Certificate

active

07372069

ABSTRACT:
In an embodiment of this invention, an adhesion layer is deposited on an encapsulation lid to provide strong adhesion with the UV-curable adhesive in order to improve encapsulation of an organic electronic device. The adhesion layer is comprised of a metallic layer or a ceramic layer that is thin enough to be nonopaque and thick enough to provide stronger adhesion at an interface with said UV-curable adhesive than said encapsulation lid.

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Merriam-Webster Online Dictionary, www.m-w.com/dictionary.
Charles A. Harper, Electronic Packaging and Interconnection Handbook, 2000, McGraw-Hill, Third Edition, pp. 1.80 and 1.81.
Charles A. Harper, Electronic Packaging and Interconnection Handbook, 2000, McGraw-Hill, Third Edition, p. 1.58.

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