Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2008-04-15
2008-04-15
Gandhi, Jayprakash N (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S689000, C439S928100
Reexamination Certificate
active
10836338
ABSTRACT:
An expansion module including a housing having an interior, an end cap connected to the housing at one end, and an interface device positioned in the housing interior is described. The end cap includes at least two throughholes to the housing interior and at least two alignment receptacles. The interface device receives a) a standard data connector via a end cap throughhole and b) a power connector via another end cap throughhole. The interface device includes an expansion device connector internal to the housing interior for providing at least one of data and power to an expansion device. An expansion module bay including a module sleeve having an opening for receiving the expansion module is described. The expansion module bay further includes a connector connected to an end of the module sleeve for connecting to the received expansion module, and a door covering the module receiving opening.
REFERENCES:
patent: 5065262 (1991-11-01), Blackborow et al.
patent: 5963422 (1999-10-01), Golobay et al.
patent: 5986889 (1999-11-01), Chang
patent: 6052278 (2000-04-01), Tanzer et al.
patent: 6064566 (2000-05-01), Agata et al.
patent: 6351394 (2002-02-01), Cunningham
patent: 6452787 (2002-09-01), Lu et al.
patent: 6456492 (2002-09-01), Wang et al.
patent: 6473297 (2002-10-01), Behl et al.
patent: 6496362 (2002-12-01), Osterhout et al.
patent: 6560099 (2003-05-01), Chang
patent: 6563701 (2003-05-01), Peng et al.
patent: 6719591 (2004-04-01), Chang
patent: 6724621 (2004-04-01), Liang
patent: 6888727 (2005-05-01), Chang
patent: 6891721 (2005-05-01), Huang
patent: 7012805 (2006-03-01), Shah et al.
patent: 2001/0001529 (2001-05-01), Behl et al.
patent: 2003/0099094 (2003-05-01), Coles et al.
patent: 2004/0242064 (2004-12-01), Chang et al.
patent: 0426414 (1991-05-01), None
patent: 2004017159 (2004-02-01), None
European Search Report of Patent Application No. 05252742 mailed Oct. 11, 2007.
Gandhi Jayprakash N
Hewlett--Packard Development Company, L.P.
Wright Ingrid
LandOfFree
Interface for expansion module and expansion module bay does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Interface for expansion module and expansion module bay, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interface for expansion module and expansion module bay will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3922628