Interdigitated trans-die lead method of construction for maximiz

Details Interdigitated trans-die lead method of construction for maximiz Interdigitated trans-die lead method of construction for maximiz

1990-05-14

1991-12-24

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437211, 357 70, H01L 2160, H01L 2156, H01L 21603, H01L 21607

Patent

active

050752529

ABSTRACT:
A novel implementation of a tape automated bonding process of attaching leads to a semiconductor die is disclosed which utilizes a method of attaching tape leads which extend across the interior surface of the die rather than radially outwardly from the die. Two-layer or three-layer tape construction is used, with the insulation being located between the top of the die and the leads. This technique enables lead placement on opposite sides of the die in interdigitated fashion, allowing die to be installed on a circuit board more closely adjacent than has previously been possible.

REFERENCES:
patent: 4496965 (1985-01-01), Orcutt et al.
patent: 4733014 (1988-03-01), Fierkens

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