Interdigitated IMPATT devices

Details Interdigitated IMPATT devices Interdigitated IMPATT devices

1984-07-13

1986-06-24

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

148DIG75, 148DIG135, 357 13, 357 16, 357 56, 357 76, 29576J, 29576W, 29580, 29591, H01L 2912, H01L 2940

Patent

active

045960704

ABSTRACT:
The disclosure relates to a semiconductor substrate having an active area for formation of an IMPATT device which is formed as a plurality of separated fingers having a common n+ region to spread the area over which the IMPATT is disposed and which provides such additional area for dissipation of heat through the substrate.

REFERENCES:
patent: 3383760 (1968-05-01), Shwartzman
patent: 3427515 (1969-02-01), Blicher et al.
patent: 4197551 (1980-04-01), Adlerstein
patent: 4237600 (1980-12-01), Rosen et al.
patent: 4258375 (1981-03-01), Hsieh et al.
patent: 4278986 (1981-07-01), Mader
patent: 4319265 (1982-03-01), Rosen et al.
patent: 4384400 (1983-05-01), Rosen et al.
patent: 4502914 (1985-03-01), Trumpp et al.

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