Interdigitaded capacitors

Details Interdigitaded capacitors Interdigitaded capacitors

2006-04-04

2006-04-04

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Making passive device

Stacked capacitor

C438S239000, C438S253000

Reexamination Certificate

active

07022581

ABSTRACT:
The specification describes matched capacitor pairs that employ interconnect metal in an interdigitated form, and are made with an area efficient configuration. In addition, structural variations between capacitors in the capacitor pair are minimized to provide optimum matching. According to the invention, the capacitor pairs are interdigitated in a manner that ensures that the plates of each pair occupy common area on the substrate. Structural anomalies due to process conditions are compensated in that a given anomaly affects both capacitors in the same way. Two of the capacitor plates, one in each pair, are formed of comb structures, with the fingers of the combs interdigitated. The other plates are formed using one or more plates interleaved between the interdigitated plates.

REFERENCES:
patent: 5126280 (1992-06-01), Chan et al.
patent: 5192703 (1993-03-01), Lee et al.
patent: 2002/0076894 (2002-06-01), Hori et al.
patent: 2003/0089941 (2003-05-01), Baker et al.
patent: 2003/0113967 (2003-06-01), Allman et al.
patent: 2004/0046230 (2004-03-01), Bernstein et al.
patent: 2004/0219757 (2004-11-01), Olewine et al.

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