Interconnections resistant to wicking

Details Interconnections resistant to wicking Interconnections resistant to wicking

2011-03-08

2011-03-08

Potter, Roy K (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C257SE23031

Reexamination Certificate

active

07901995

ABSTRACT:
The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices.The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general.For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with.For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

REFERENCES:
patent: 4827611 (1989-05-01), Pai et al.
patent: 6670215 (2003-12-01), Miyazaki et al.
patent: 7239008 (2007-07-01), Nakamura
patent: 7408242 (2008-08-01), Yamanaka et al.

Affiliated with

Also associated with

Rating

Interconnections resistant to wicking does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnections resistant to wicking, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnections resistant to wicking will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2619580