Interconnections for integrated circuits

Details Interconnections for integrated circuits Interconnections for integrated circuits

2006-03-23

2009-08-04

Whitmore, Stacy A (Department: 2825)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S734000, C257S786000

Reexamination Certificate

active

07569938

ABSTRACT:
An interconnect connection structure having first and second interconnects and multiple connection elements that electrically connect the first interconnect to the second interconnect is described. The multiple connection elements are formed laterally in a lateral region of the first and second interconnects relative to an overlay orientation of the interconnects. A central region may be free of connection elements so that electro-migration properties of the connection structure are improved and the current-carrying capacity is increased.

REFERENCES:
patent: 5955788 (1999-09-01), Iwasa
patent: 5963831 (1999-10-01), Fu
patent: 6548902 (2003-04-01), Suzuki et al.
patent: 2002/0127846 (2002-09-01), Burrell et al.
patent: 0 845 808 (1998-06-01), None
patent: 1 220 315 (2002-03-01), None
patent: 60201648 (1985-10-01), None

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