Interconnection technique using dielectric layers

Details Interconnection technique using dielectric layers Interconnection technique using dielectric layers

1987-11-27

1989-06-27

Gallagher, John J.

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

29850, 156 65, 156297, 156299, 156300, 156305, 174117F, 174117FF, 228179, 361408, H01R 400

Patent

active

048431915

ABSTRACT:
In accordance with one embodiment of the invention, a process for interconnecting the circuitry of two substrates comprises the step of terminating the circuitry on bonding pads that are arranged in parallel rows with the first row of each substrate being nearest an edge of the substrate. The bonding pads of the two first rows of the two substrates are joined by conductors of a dielectric tape that bridges the two substrates. The conductors overlap the edges of the dielectric tape and are organized to permit them to be bonded to corresponding bonding pads of the two substrates, for example, by soldering. The two second rows of bonding pads are joined by conductors on a second dielectric tape which is wide enough to cover two first rows of bonding pads and thereby provide electrical insulation. In like manner, successive tape layers are of progressively wider widths to provide insulation from interconnections beneath them, while permitting conductors carried by the tapes to overlap the edges and contact exposed bonding pads. In this manner, the principle of TAB bonding can be used for making connections to the bonding pads of chips without the need for arranging all of the bonding pads in a single row along the edge of the chip.

REFERENCES:
patent: 4255613 (1981-03-01), Ketchpel
patent: 4385202 (1983-05-01), Spinelli et al.
patent: 4472762 (1984-09-01), Spinelli et al.
patent: 4546406 (1985-10-01), Spinelli et al.
patent: 4652970 (1987-03-01), Watari et al.

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