Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Patent
1997-06-11
1999-05-18
Dutton, Brian
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
438118, 438459, 438977, H01L21/00;21/44;21/48;21/30
Patent
active
059044950
ABSTRACT:
A hybrid integrated circuit and method of fabricating a hybrid integrated circuit. A first wafer is provided having a first surface with a first electrical contact for a first active circuit associated therewith and a second surface. A second wafer is provided having a third surface with a second electrical contact for a second active circuit associated therewith and a fourth surface, the second wafer being chemically thinned at the fourth surface. The first and second wafers are bonded together at an interface between the first and third surfaces such that the first and second electrical contacts are relatively aligned with one another. The fourth surface of the second wafer is processed to define an access via to both the first and second contacts. An electrical interconnection is formed between the first and second contacts within the access via so that the first and second active circuits are electrically interconnected.
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Burke Barry E.
Kosicki Bernard B.
Dutton Brian
Massachusetts Institute of Technology
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