Patent
1989-08-07
1991-02-12
Lee, John D.
350 9621, 350 9622, G02B 642
Patent
active
049919270
ABSTRACT:
Electrical circuits can be built up in three dimensions by using spacers which interlock together to define stacks. Stacks can be used to clamp together chip carriers between adjacent spacers or to provide power and signal transmission stacks which have a number of continuous tracks. Link members are used to provide electrical connection means between the chip carriers in the chip carrier stacks and the tracks of the power and signal transmission stacks.
REFERENCES:
patent: 4872843 (1989-10-01), Anstey
Dowty Electronic Components Limited
Heartney Phan T.
Lee John D.
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