Interconnection system for integrated circuits

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

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Details

361744, 361784, 361807, 174255, 174261, 257700, H05K 100

Patent

active

053031199

ABSTRACT:
The invention concerns a carrier for Integrated Circuits (ICs). The ICs are carried by a multi-layer board, constructed of individual layers. Some layers carry conductive traces, and the traces are connected together to form a 3-dimensional network connecting the ICs. The individual layers are constructed of a flexible material, which is commercially available in large sheets, thus allowing multiple copies of the trace patterns to be printed simultaneously. The multi-layer board is attached to a standard printed circuit board, by pins which are driven through them both, and soldered into place.

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IBM Technical Disclosure Bulletin, vol. 30, No. 2, Jul. 1987, pp. 772-773.

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