Interconnection system for high performance electronic hybrids

Details Interconnection system for high performance electronic hybrids Interconnection system for high performance electronic hybrids

1992-05-05

1994-09-06

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361765, 361772, 361777, 439 65, H05K 702

Patent

active

053453654

ABSTRACT:
An interconnection system for high performance electronic hybrids employs micro-machined features on a substrate to connect directly to miniature electronic components, such as integrated circuits. The micro-machined features may include posts for connecting to bonding pads of standard components and may also include rails for alignment of components and connections to specially made components.

REFERENCES:
patent: 4813129 (1989-03-01), Karnezos
patent: 4924353 (1990-05-01), Patraw
Article: Hiroshi Yamada, 1992, IEEE/CHMT Int'l Electronics Manufacturing Technology Symposium, pp. 288-292, A fine pitch and high aspect ratio bump array for flip-chip interconnection.
Article: Kulesza et al., Feb. 1992, The Magazine for Advanced Packaging Solutions, 6 pages, Hybrid Circuit Technology.
Article: Feb. 1989, AT&T Elastomeric Conductive Polymer Interconnect, 4 pages.
Article: 1992, Scotch Brand 9703 Conductive Adhesive Transfer Tape, 4 pages.
Wafer-Scale Systems Technology for Strategic Computing Program, ESD-TR-91-068, Massachusetts Institute of Technology Lincoln Labs, Mar. 31, 1991 Report, Issued May 10, 1991, pp., 25-27.

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