Interconnection system and method of assembly

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

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Details

29625, 317101B, H05K 320

Patent

active

039964167

ABSTRACT:
A substrate provided with top and bottom metal clad surfaces is provided with first apertures. The top cladding and the first apertures are protected by a cover film. Insulation covered wires extend across the bottom metal cladding. The ends of the wire are inserted through apertures of the substrate and protrude through the cover. The additional apertures are filled wit sealant and the protruding wire ends are then trimmed to equal lengths protruding above the top metal cladding. The cover is then removed exposin the first apertures and the trimmed wire ends embedded in and strengthened by the sealant. Plating connects the wire ends to the top metal cladding, covers the wires to provide shielding and provides metal linings in the first apertures which linings are connected to the top and bottom layers of cladding. The top metal cladding and the plating thereover are selectively removed providing electrical pads adhered to corresponding wire ends and to corresponding metal linings. In an alternative embodiment pads are provided by plating the wire ends prior to removal of the cover such that pads on the wire ends protrude above the top metal cladding layer. In another alternative embodiment the wire ends are trimmed to the level of the top metal cladding prior to plating.

REFERENCES:
patent: 3134690 (1964-05-01), Eriksson
patent: 3267407 (1966-08-01), Humphries et al.
patent: 3296099 (1967-01-01), Dinella
patent: 3436604 (1969-04-01), Hyltin et al.
patent: 3659340 (1972-05-01), Giedd et al.
patent: 3872236 (1975-03-01), Swengel, Sr. et al.

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