Interconnection substrate and semiconductor device,...

Details Interconnection substrate and semiconductor device,... Interconnection substrate and semiconductor device,...

2008-01-02

2011-12-20

Warren, Matthew E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S762000, C257SE23145, C257SE21585, C438S256000

Reexamination Certificate

active

08080875

ABSTRACT:
An interconnection substrate including therein one or more resin layers, each of the resin layers including therein a via-hole penetrating from a top surface to a bottom surface of the resin layer. A via-plug of metal particles is formed in the via-hole. Each of the metal particles has a flattened shape generally parallel to a plane of the resin layer.

REFERENCES:
patent: 5746868 (1998-05-01), Abe
patent: 7579251 (2009-08-01), Imanaka et al.
patent: 2001/0004944 (2001-06-01), Nakamura et al.
patent: 2001/0051673 (2001-12-01), Suzuki et al.
patent: 2002/0050407 (2002-05-01), Sohn et al.
patent: 2004/0056344 (2004-03-01), Ogawa et al.
patent: 2004/0212091 (2004-10-01), Asahi et al.
patent: 2601128 (1997-04-01), None
patent: 2004-339565 (2004-12-01), None
patent: 2004-342831 (2004-12-01), None
patent: 2005-005645 (2005-01-01), None
patent: 2006-147734 (2006-06-01), None
patent: 2006147734 (2006-06-01), None
Akedo, Jun “Aerosol Deposition of Ceramic Thick Films at Room Temperature: Densification Mechanism of Ceramic Layers”, J. Am Ceram. Soc. 89 (6) Jun. 2006, pp. 1834-1839.
“JP Official Action”, mailed by JPO and corresponding to Japanese application No. 2007-038199 on Jul. 19, 2011, with partial English translation.

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