Interconnection structure with raised perimeter portions

Details Interconnection structure with raised perimeter portions Interconnection structure with raised perimeter portions

1991-09-10

1999-03-02

Sikes, William L.

Liquid crystal cells, elements and systems

Particular structure

Having significant detail of cell structure only

257 81, 257735, 257778, G02F 133

Patent

active

058778330

ABSTRACT:
By providing an interconnection structure (1) with strip-shaped elevations (11) which, in a plan view, are preferably asterisk-shaped, the contact face is cleaned during compression and an adhesive can easily flow away. The interconnection structure is very suitable for face-down bonding of drive ICs in a display device.

REFERENCES:
patent: 4826297 (1989-05-01), Kubo et al.
Toute L'Electronique, No. 534, May 1988, Paris, Fr. pp.18-23; Y. Linuma et al "Techniques Des Ecrans & Cristaux Liquides".

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