Interconnection structure for integrated circuits and method for

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Charge transfer device

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257784, H01L 2348, H01L 2946, H01L 2962, H01L 2964

Patent

active

053230353

ABSTRACT:
A device for making temporary or permanent electrical connections to circuit pads of an integrated circuit is made with conventional semiconductor fabrication processes. The device has a supporting substrate from which project a plurality of insertion structures that are in mating alignment with corresponding circuit pads of the integrated circuit. Each insertion structure is metallized to make electrical contact with the corresponding circuit pad. The electrical contacts may be temporary or permanent depending upon the choice of metallization and the pressure applied to the contacting surfaces. The insertion structure devices have particular application for functional testing, electrical burn-in and packaging of an integrated circuit either as a full wafer or as an individual die.

REFERENCES:
patent: 4862243 (1989-08-01), Welch et al.
patent: 5048744 (1991-09-01), Chang et al.
patent: 5177439 (1993-01-01), Liu et al.

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