Interconnection structure and method for designing the same

Details Interconnection structure and method for designing the same Interconnection structure and method for designing the same

2005-09-13

2005-09-13

Sarkar, Asok Kumar (Department: 2891)

Semiconductor device manufacturing: process

Dummy metallization

C257S758000, C257S760000, C438S128000

Reexamination Certificate

active

06943129

ABSTRACT:
A wiring pattern has been enlarged by mutually different values, thereby forming two enlarged wiring patterns are formed. Then, regions where the two enlarged wiring patterns overlap each other are removed, thereby forming a dummy pattern. Alternatively, a simple-figure pattern made of simple figures is formed and a dummy pattern is formed using the simple-figure pattern. A gap that is not wider than a predetermined value is located in a final wiring pattern made of the wiring pattern and the dummy pattern is defined as an air gap region. Thus, an interconnection structure incorporating air gaps between wiring patterns is formed.

REFERENCES:
patent: 5652465 (1997-07-01), Hosoda et al.
patent: 5869880 (1999-02-01), Grill et al.
patent: 5960311 (1999-09-01), Singh et al.
patent: 5970238 (1999-10-01), Shibata et al.
patent: 6093633 (2000-07-01), Matsumoto
patent: 6150232 (2000-11-01), Chan et al.
patent: 6226782 (2001-05-01), Nowak et al.
patent: 7-193125 (1995-07-01), None
patent: 09081622 (1997-03-01), None
patent: 2001-77115 (2001-03-01), None

Affiliated with

Also associated with

Rating

Interconnection structure and method for designing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnection structure and method for designing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnection structure and method for designing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3427056