Wave transmission lines and networks – Coupling networks – With impedance matching
Patent
1992-07-16
1994-04-12
Nelli, Raymond A.
Wave transmission lines and networks
Coupling networks
With impedance matching
439 75, 333260, H01P 100
Patent
active
053029232
ABSTRACT:
An interconnection plate apparatus provides high frequency signal paths for communication among multiple pc boards and/or high frequency system components. The apparatus includes an interconnection plate which is a conductor having cross-sectional channels at which transmission line structures are formed. The transmission line structure includes a through-plate conductor concentrically surrounded by a through-plate insulator concentrically surrounded by the channel walls. An RF ground ring is positioned between the interconnection plate and a pc board at the transmission line structure. The interconnection plate provides a common ground reference and a common ground path for each board mounted to the interconnection plate. The ground ring structures assure a stable ground connection between the interconnection plate and the pc board ground planes. Different transmission line structures implement different signal transformation functions. The transmission line structure may simply pass the signal. In one embodiment, however, the transmission line structure serves as a low-pass filter.
REFERENCES:
patent: Re27089 (1971-03-01), Sear et al.
patent: 3351816 (1967-11-01), Sear et al.
patent: 3351953 (1967-11-01), Sear
patent: 4390221 (1983-06-01), Niles et al.
patent: 4736266 (1988-04-01), Tanibe
patent: 4737116 (1988-04-01), Slye et al.
patent: 4841414 (1989-06-01), Hibino et al.
patent: 4939624 (1990-07-01), August et al.
patent: 4994771 (1991-02-01), Takamine et al.
patent: 5023754 (1991-06-01), Aug et al.
patent: 5041945 (1991-08-01), Suzuki
patent: 5101322 (1992-03-01), Ghaem et al.
patent: 5107404 (1992-04-01), Tam
patent: 5184095 (1993-02-01), Hanz et al.
patent: 5211567 (1993-05-01), Neumann et al.
patent: 5224918 (1993-07-01), Neumann et al.
Mason Roy L.
Pietsch James K.
Richer Paul A.
Hewlett--Packard Company
Nelli Raymond A.
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