Interconnection package suitable for electronic devices and meth

Details Interconnection package suitable for electronic devices and meth Interconnection package suitable for electronic devices and meth

1986-10-20

1988-06-07

Pellinen, A. D.

Electricity: electrical systems and devices

Miscellaneous

29830, 156629, 361386, H05K 702

Patent

active

047500921

ABSTRACT:
An interconnecting package for attaching electronic devices, such as semiconductor chips, to an interconnection board and processes for the production and mounting thereof. The interconnection package comprises a multiplicity of metallic leads or pins aligned in a regular array and a first substrate of molded plastic material around the metallic leads or pins with the metallic leads or pins extending through the first substrate. A conductive pattern is formed on a surface, the conductive pattern being adapted to electrically connect to the electronic device, and the conductive pattern extends into a multiplicity of recesses. Each of said metallic leads or pins extends into a corresponding recess and makes an electrical connection to the conductive pattern within the recess.

REFERENCES:
patent: 3495023 (1970-02-01), Hessinger
patent: 4074342 (1978-02-01), Honn et al.
patent: 4082394 (1978-04-01), Gedney et al.
patent: 4132856 (1979-01-01), Hutchinson et al.
patent: 4396936 (1983-08-01), McIver et al.
patent: 4396971 (1983-08-01), Beall et al.
patent: 4420877 (1983-12-01), McKenzie, Jr.
patent: 4437141 (1984-03-01), Prokop
patent: 4602318 (1986-07-01), Lassen
patent: 4618739 (1986-10-01), Theobald
Foster et al., "Thermally Enhanced Package for Semiconductor Devices", Dec. 1977.

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