Interconnection of opposite sides of a circuit board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174265, 428901, 29852, 29846, H05K 100

Patent

active

052275884

ABSTRACT:
A circuit board comprising a dielectric composite (20,22,24) clad with electrical circuitry (16,38) is provided with an improved electrical interconnection between alternate conductive circuitry planes of the substrate. Connecting features (18,40) integral with the conductive circuitry on each conductive plane of the substrate extend into a through hole (30) of the substrate toward each other and are fused (46) to one another by irradiation from a laser beam. In another embodiment a connecting feature (52) from only one of the circuit layers (50) extends into the through hole (66) of the dielectric (60,62,64) and is electrically connected and physically bonded to the circuitry layer on the other side of the substrate by means of fusion or a drop (68) of electrically conductive resin interposed between the raised connector feature and the opposed circuit layer (74). The resin is applied and semi-cured to a "B"-stage, and then the conductive circuit layers and dielectric are laminated together under heat and pressure to form the substrate. The resin flows into the dielectric hole and over and around the connective feature and thereby providing contact with the circuitry layer of the opposing side. Thereafter the resin is cured to form a strong mechanical and electrical contact.

REFERENCES:
patent: 3077511 (1963-02-01), Bohrer et al.
patent: 3148310 (1964-09-01), Feldman
patent: 3350498 (1967-10-01), Leeds
patent: 3471631 (1969-10-01), Quintana
patent: 3953924 (1976-05-01), Zachry et al.
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 4238527 (1980-12-01), Monnier et al.
patent: 4563543 (1986-01-01), Kersuzan et al.
patent: 4646436 (1987-03-01), Crowell et al.
patent: 4788766 (1988-12-01), Burger et al.
patent: 4994771 (1991-02-01), Takamine et al.
patent: 5032694 (1991-07-01), Ishihara et al.
patent: 5046238 (1991-09-01), Daigle et al.
Lindenmeyer, Carl W. "Double Side Circuit Board and A Method for its Manufacture", US Statortory Invention Registration, No. H650, Jul. 4, 1989.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Interconnection of opposite sides of a circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Interconnection of opposite sides of a circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnection of opposite sides of a circuit board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2313742

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.