Interconnection of integrated circuit metallization

Details Interconnection of integrated circuit metallization Interconnection of integrated circuit metallization

1976-12-22

1978-08-22

James, Andrew J.

357 71, 357 73, H01L 2348, H01L 2944, H01L 2952

Patent

active

041092759

ABSTRACT:
In the fabrication of integrated circuits, step or ridge peak problems in forming via openings through sputtered quartz coatings to underlying metallization are minimized by subdividing the contact portions thereof into a plurality of adjacent line segments, and forming the via opening between the elevations or peaks on the line segments to expose portions thereof for interconnection by higher metallization levels.

REFERENCES:
patent: 3303071 (1967-02-01), Kocsis
patent: 3390308 (1968-06-01), Marley
patent: 3577036 (1971-05-01), Curtis
patent: 3577175 (1971-05-01), Gri
patent: 3751292 (1973-08-01), Kongable
patent: 3823349 (1974-07-01), Dhaka et al.
patent: 3855610 (1974-12-01), Masuda et al.
patent: 4000502 (1976-12-01), Butler et al.
patent: 4023197 (1977-05-01), Magdo et al.
IBM Technical Disclosure Bulletin; Barrel Connector, by Kryzaniusky, vol. 14, No. 9, Feb. 1972, p. 2599.

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